High Performance Compilation, Computing and Communications (HP3C 2025)

★Full name: 2025 9th International Conference on High Performance Compilation, Computing and Communications

★Event Acronym: HP3C 2025

★Website: http://www.hp3c.net

★Time: August 27-29, 2025

★Place: Jinan, China

The accepted paper will be included into HP3C 2025 Conference Proceedings, which will be published in the International Conference Proceedings Series, which will be archived in the ACM Digital Library, and indexed by Ei Compendex and Scopus and submitted to be reviewed by Thomson Reuters Conference Proceedings Citation Index (ISI Web of Science).

HP3C2024 - ISBN: 979-8-4007-1690-4 - ACM Digital Library Online | Ei-Compendex & Scopus

HP3C2023 - ISBN: 978-1-4503-9988-3 - ACM Digital Library Online | Ei-Compendex & Scopus
HP3C2022 - ISBN: 978-1-4503-9629-5 - ACM Digital Library Online | Ei-Compendex & Scopus (Ei核心检索和Scopus收录)

......

HP3C2017 - ISBN: 978-1-4503-4868-3 - ACM Digital Library Online | Ei-Compendex & Scopus

Contacts

Conference Secretariat: Ms. Losi Luo

E-mail: hp3c_conf@outlook.com
Tel: ++86-18030559376
Working Hours: 09:30 - 18:00, from Monday to Friday.

★Keynote Speakers★

Prof. Keun Ho Ryu, Chungbuk National University, Korea;

Prof. Kwang Woo Nam, Kunsan National University, Korea

Prof. Yongde Guo, City University of Macau, Macau, China.

★Call for paper★

Topic about High Performance Compilation, Computing and Communications

Track 1: System Architecture

Track 2: Applications/Algorithms

Track 3: Emerging Technologies

Track 4: Parallel Programming Models & Performance Modelling

Track 5: Machine Learning

Track 6: Cloud Computing

Track 7: High Performance Distributed Computing

Track 8: Blockchain

For details about topics, please visit at http://www.hp3c.net/cfp.html

▶ Honorary Chair

Yinglong Wang, National Supercomputer Center in Jinan, China

▶ International Advisory Committee

Witold Pedrycz, IEEE Life Fellow, University of Alberta, Edmonton, Canada
Qingfu Zhang, City University of Hong Kong, Hong Kong, China
James Lin, Shanghai Jiao Tong University, China
Jason Dai, Principle Engineer and CTO, Big Data Technologies, Intel

▶ Conference Chair

Meihong Yang, Qilu University of Technology (Shandong Academy of Sciences), China

▶ Conference Co-chairs

Xiaoming Xiong, Guangdong University of Technology, China
Steven Guan, Xi'an Jiaotong-Liverpool University, China

- Technical Program Committee Chairs

Xiaoming Wu, Qilu University of Technology (Shandong Academy of Sciences), China
Shahadat Hossain, University of Northern British Columbia, Canada

▶ Technical Program Committee Vice-chair

Yoshifumi Manabe,Kogakuin University, Japan
Jingshan Pan, Qilu University of Technology (Shandong Academy of Sciences), China
Jianqiang Huang, Qinghai University, China

▶ Local Organizing Chair

Wei Ding, Qilu University of Technology (Shandong Academy of Sciences), China

▶ Publication Chairs

Yuedong Yang, Sun Yat-sen University, China
Wei Zhang, Qilu University of Technology(Shandong Academy of Sciences), China

▶ Publicity Co-chairs

Ying Guo, Qilu University of Technology (Shandong Academy of Sciences), China
Ljiljana Trajkovic, Simon Fraser University, Canada
Jian Wang, Kunming University of Science and Technology, China
Dayang Norhayati Abang Jawawi, Universiti Teknologi Malaysia, Malaysia
Siti Zaiton Mohd Hashim, Universiti Teknologi Malaysia, Malaysia
Beligiannnis Grigorios, University of Patras, Greece

- Special Session Chairs

Hui Zhang, Southwest University of Science and Technology, China
Jianpo Li, Northeast Electric Power University, China

Submission Requirement

◆ Online Submission System: http://www.zmeeting.org/submission/hp3c2025

◆ The manuscript must be in English. For your submission, you can use the standard ACM conference templates for Microsoft Word (At least 8 pages) or LaTeX (At least 4 pages) formats.

◆ If you want to present your research on HP3C-2025, NO publication purpose, abstract must to be submitted

◆ At least one of the authors listed on the accepted paper must register by the deadline. more.